Study on the Moisture Permeation Resistance of Nano-Ti Polymer for Electronic Device Package
碩士 === 逢甲大學 === 材料與製造工程所 === 92 === Organic light-emitting diode (OLED) and flip chip ball grid array (FCBGA) are two important technologies for current panel displays industry and IC assembly industry, respectively. The key task of these two technologies is to overcome the reliability and lifetime...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/61189500363257540197 |