Interdiffusion for Electroless Nickel Plated Silicon
碩士 === 逢甲大學 === 材料科學所 === 92 === During the electroless nickel plating on silicon wafer , sodium hypophosphite and hydrazine were used as a reducing agent . The amount of the phosphorous of the deposit was varied with the pH values of the solution . Heat treatment under the argon atmosphere was perf...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/81477645468330867061 |