| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 92 === Electronic products are easily damaged by thermal stress and warpage caused by the variation of temperature. According to analysis results from CAE, problems can be found in advance and better product can be made.
The CAE software, ANSYS, can be used to simulate the thermal and structural behavior by the analytic technique of element birth-and-death. This analytic technique is extensively used in sequential assembly, annealing, staged construction. This study is divide into two subjects. One is the DC-DC converter which has different stand-offs and thicknesses at temperature loading. The detail 3D model of converters is constructed to understand the behavior of all important components under the thermal cyclic test. The other is the continuous warpage analysis of FCBGA. This study tries to predict the accumulated warpage of FCBGA throughout the sequential packaging process. The simulation results are further verified by experimental data.
This study shows the capability of CAE to simulate the complex geometry and process. The results can help understand the relations of material, process, and product.
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