Thermal Behavior Analysis for DC-DC Converter and FCBGA
碩士 === 中原大學 === 機械工程研究所 === 92 === Electronic products are easily damaged by thermal stress and warpage caused by the variation of temperature. According to analysis results from CAE, problems can be found in advance and better product can be made. The CAE software, ANSYS, can be used to simulate t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/y993sz |