The Design Analysis and Delamination Prevention for a Leadframe Type 3D Stacked Package
碩士 === 元智大學 === 機械工程學系 === 91 === The three-dimensional stacked package is one of a multi-chip package that the dies are stacked vertically. The delamination of the package is often observed during the manufacturing and using environments. The study focuses on designing a lead frame type 3D package...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42099767843552493809 |