Thermal Analysis of Electronic Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 91 === The thesis describes the thermal analysis of electronic packages. CFD software ANSYS/FLOTRAN is performed to simulate the thermal convective effect. Thermal analysis model of small area plate (horizontal and vertical) with surrounding air is built by CFD. Mesh...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36165595147607746528 |