Application of Neural Network and Tabu Search to Find the Optimal Parameter of Wire Bonding Process in Semiconductor Packaging
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 91 === With the prosperous development of high tech industry, the trend for electronics products not only has to be light, slimmer, and small, but also has to be multi-functional. The impact of this trend on the semiconductor industry is the in the increase...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23297561929399719194 |