Development of a Defect Inspection System for a BGA with any Rotation Angle
碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 91 === Recently, the new package method BGA(ball grid array) gradually replaces the traditional package method QFP(Quad Flat Package). The main purpose of this research is to develop a two-dimension BGA defect inspection system. This system can detect defects like b...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/62745272807014111421 |