Effects of Surfactants on Chemical Mechanical Polishing Wastewater Treated by Electro-coagulation-flotation Process
碩士 === 國立臺灣大學 === 環境工程學研究所 === 91 === Chemical mechanical polishing (CMP) is the process which provides global planarization on the surface of wafers in the semiconductor industry. CMP wastewater consists of high-density and extremely stable nanoparticles and chemicals (e. g., dispersants and corros...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03328716056604017867 |