Mechanical Properties of MEMS Thin Films

• Main Authors: Wu-Fone Yeh, 葉伍峰
• Other Authors: K. C. Wu
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/92968253381818118110

碩士 === 國立臺灣大學 === 應用力學研究所 === 91 === This dissertation starts with mechanics of materials and basic theorem of electromagnetics and tries to design several kinds of test keys. With the combination of test keys and optical measurement system which can construct a complete measuring process. This process expects to provide a feasible way to gauge the material mechanical properties of MEMS electrical films and consider the possibility to combine test keys with the present day semiconductor fabrication technique. This research has successfully achieved to make some parts of test keys. According to the built measuring process also complete the work form the designation, theory analysis, fabrication process and optical measurement to inverted parameter calculation, which proves the feasibility and validity of test keys in the combined measuring process. During the theoretical twisting and bending analysis of test keys, considering their structure properties and cleverly applying with an each identity mode of resonance in microstructure. This is a real innovation which not needs to accurately measure the geometric sizes of microstructures, but obtains the Poisson’s ratio of the materials. Applying concentrate load to actuate tests keys and with the relation of loading and strain which can obtain the Young’s modulus of the material. The research of test keys involving types of cantilever beam and fixed-fixed ends, which desirably construct the math model between the electrostatic force and strain in microstructures. By such theoretical analysis that will have more clear concepts of electrostatic force actuated microstructures. Some test keys are sent to CIC for examination, then to TSMC for chip-size fabrication, and some are processed in NSCMEMS center. Regardless of both processes which are designed with the consideration of compatible standard process. The rich experiences of using dry and wet etching techniques in process could be dependable references for releasing MEMS devices. The research in mechanical properties of MEMS thin films are basic but quite difficult to do. This research provides a reasonable and feasible measuring process, which is needed to take more concentration on basic concepts and mechanical phenomenon of microstructures. It is quite different from those MEMS devices which merely emphasize on operating efficiency.