Development and Application of Three Dimension Ball Grid Array Inspection System
碩士 === 國立臺灣大學 === 機械工程學研究所 === 91 === The aim of this study is to construct a prototype of Precision 3D Measurement System for the Dimensional Inspection of BGA Components, which could be integrated into the process of BGA packaging. This system focus on the 3D inspection on Coplanarity, Ball height...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04256021989772960837 |