Endpoint Detection for Metal Chemical Mechanical Planarization
博士 === 國立清華大學 === 動力機械工程學系 === 91 === As the number of metal levels and the wafer size increase, the need for global planarity across the wafer becomes more crucial. Chemical mechanical planarization (CMP) is considered the key technique to achieve this goal. Accurate in-situ endpoint detection and...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/48967989073723136534 |