The Study of Formation of Nickel Silicides with a Stress Field and a Thin Interlayer of CrOx

碩士 === 國立清華大學 === 材料科學工程學系 === 91 === Metal silicides have been widely used to reduce the resistance of source/drain of microelectronic devices. Among all metal silicides, NiSi is one of the most promising silicides due to good self-aligning properties for ULSI technology. NiSi possesses...

Full description

Bibliographic Details
Main Authors: Ching-Ming Shui, 徐慶銘
Other Authors: Cho-Jen Tsai
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/18386011831418136613

Similar Items