Study on the Polishing Characteristics of Silicon Wafer for New Type Ultraprecision Polisher

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 91 === In conventional abrasive machining , it must using dresser to dress the surface of polishing disc periodically , in order for polishing disc to maintain its ability of machining , and then ensuring the quality of work piece. It will make polishing disk thin...

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Bibliographic Details
Main Authors: Wei-Hang Huang, 黃韋翰
Other Authors: none
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/83368648026027811670