Investigation of Cu Electroplating and Electropolishing Processing for Multilevel Interconnection
博士 === 國立交通大學 === 材料科學與工程系 === 91 === Electroplating (ECP) has been the leading method for Damascene Cu deposition in multilevel interconnection due to its low cost, high throughput and superior gap-filling capability. To achieve defect-free filling in sub-0.2 m trenches/vias, various plating bath...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/53644342436488217197 |