Electromigration Studies of Sn95/Sb5 Flip Chip Solder Bumps
碩士 === 國立交通大學 === 材料科學與工程系 === 91 === Abstract All the previous researches of SnSb solder bumps were focused on the mechanical properties. However, the electromigration behavior of SnSb bumps has become more and more important as the dimension of the bumps shrinks. The electr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58447832010300064330 |