A Multi-Objective Metamodeling Approach inSolving Parameters Design Problems-A Case Study on Integrated-Circuit Ink Marking Facilities

碩士 === 國立成功大學 === 製造工程研究所碩博士班 === 91 === Semiconductor packing plant is a typical foundry factory and its products carry the feature of small in quantity and rich in variety. Since different products require various parameters, it leads to frequent changes in setup. Further, due to the increasing co...

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Bibliographic Details
Main Authors: Po-Hung Chou, 周柏宏
Other Authors: Taho Yang
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/40498835933778938066
Description
Summary:碩士 === 國立成功大學 === 製造工程研究所碩博士班 === 91 === Semiconductor packing plant is a typical foundry factory and its products carry the feature of small in quantity and rich in variety. Since different products require various parameters, it leads to frequent changes in setup. Further, due to the increasing complexity of the product design, more than one quality characteristic must be considered simultaneously to improve the product quality. Therefore, this research uses simulation methods as the tool. Taguchi method, technique for order preference by similarity to ideal solution method, principal components analysis, dual response surface method and scatter search are used to optimize the multi-objective simulation models. At last, simulation methods are used to diagnose the possibilities in the parameters control. It can serve as a decision-marking reference for the on-the-scene regulators and avoid mistakes in decision-making and waste capacity. It aims to practically solve the problems in reality as the contribution of this research.