A Multi-Objective Metamodeling Approach inSolving Parameters Design Problems-A Case Study on Integrated-Circuit Ink Marking Facilities
碩士 === 國立成功大學 === 製造工程研究所碩博士班 === 91 === Semiconductor packing plant is a typical foundry factory and its products carry the feature of small in quantity and rich in variety. Since different products require various parameters, it leads to frequent changes in setup. Further, due to the increasing co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40498835933778938066 |