Theoretical Analysis and Experiments for the Effect of Pad Pattern on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === In Chemical Mechanical Polishing (CMP), the material and pattern of pad are chosen by considering for the coating of wafer. The rule that pattern of pad plays in CMP is very complicated and there are not many researches mentioned about it. Actually the pattern...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/41323185242360299509 |