Interfacial Microstructure and Shear Strength on Sn-Ag-xSb Lead-Free Solder Joints with Au/Ni-P/Cu UBM
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === This research is to discuss the effects of the microstructure by adding 0-10wt% Sb into Sn3.5Ag lead-free solder as well as the interfacial microstructure variations of Sn-Ag-xSb solder combining with Au/Ni-P/Cu UBM. The Single Lap specimens and high temperatu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49821621346998925078 |