The Microstructure and Low Cycle Fatigue of Sn-Ag-xSb Lead-Free Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === The goal of this research is to evaluate the effect of Sb additions (0~10 wt%) on the melting point and microstructure of Sn-Ag solder. The reliability of low cycle fatigue of the solder joint is evaluated by the thermal storage test for 150˚C. The materials...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/06903952361823730750 |