Research in the Strength Improvement of Golden Wire Bonding in BGA by the RF Plasma Cleaning
碩士 === 國立成功大學 === 工程科學系專班 === 91 === Abstract This paper is research in the strength Improvement of golden wire bonding in BGA by the13.56 MHz RF plasma cleaning. First, EDX and AES are used to identify the surface contamination condition of wire bond pad. Define the material quality as this exper...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66624314892836890036 |