The Implementation of a Flip Chip Bump 3D Profile Online Measurement System

• Main Authors: Wei-Chih Lin, 林威志
• Other Authors: Ming Chang
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/yy7yqy

碩士 === 中原大學 === 機械工程研究所 === 91 === Due to the progress of the semiconductor industry, the components are getting microminiaturized. Besides, demands of the on-line measurement system are also growing up. Therefore, this research is combining the techniques of projection fringe topography and phase shifting interferometry with a high speed and high resolution CCD to focus on completing the 3D profile on-line measurement system for components with size between 10µm-50µm. A typical example is the bump measurement on a flip chip PCB. In this research, by using of a progressive scan CCD to scan the object in speed of 166 frames per second via adjusting to a slender image is quite suitable for the developed system. The image in measurement is 1600*50 pixels corresponding to the measuring range of 16 mm*0.5mm. According to the CCD resolution of 8 bit and the interval of projected fringe of 311µm, the height measurement resolution is 1.21µm. A flat plate with a step of 9mm*9mm*50µm is used to verify the system performance. Experimental results show that the measurement precision can reach to 1.5µm. It shows not only 3D profile inspection in flip chip bump but also this measurement system can be used in other MEMS or IC assembly components.