The Implementation of a Flip Chip Bump 3D Profile Online Measurement System
碩士 === 中原大學 === 機械工程研究所 === 91 === Due to the progress of the semiconductor industry, the components are getting microminiaturized. Besides, demands of the on-line measurement system are also growing up. Therefore, this research is combining the techniques of projection fringe topography and phase s...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/yy7yqy |