| Summary: | 碩士 === 中華大學 === 機械與航太工程研究所 === 91 === The purpose of this thesis is to design a micro accelerometer by the MEMS technology. The main structures are devoted to the accelerometer design, analysis, simulation and fabrication processes. Since the MEMS technology is still under-development, there is no well design rule yet, thus there are a lot of problems to be solved. However, the traditional IC technology has well-developed design rules, thus the yield rate is high.
The materials thickness in IC are far more less than those of MEMS devices. Thus there are thermal stress problems in the latter. In this thesis this effect is analyzed first by computer simulation software such as ANSYS and IntelliSuite, then this thesis presents an annealing method to solve this problem. On the other hand, this paper also found that one should be very careful about the wet etch process, otherwise, the micro structure would be destroyed by the residual stress, shearing stress in the wet etch process. Finally, the elimination of sacrifitial layer, e.g., SiO2, studied by active RIE process. The trade-offs of both isotropic and anisotropic etching processes are also made.
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