BGA金線金球位置之自動檢測
碩士 === 中華大學 === 機械與航太工程研究所 === 91 === One of the important manufacture processes in IC packaging is the wire bond, which generates a ball-like connection on the bond pad to make the electrical connections between the chip and the substrate base. In the paper a vision inspection system was developed...
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| Format: | Others |
| Language: | zh-TW |
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2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07461979564930642957 |