Experimental Method and FE Simulation Model to Study Wafer Probe Testing Parameters
碩士 === 國立中正大學 === 機械系 === 91 === Probe card is a very important tool for wafer testing. The electrical properties could be measured from the contact between probe and bonding pad. The above process often be used to determine the die is pass or fail. The most important testing parameters that affect...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99671646741166934667 |