| Summary: | 碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 91 === ABSTRACT
There are a lot of researches on the design of clean rooms due to they are the bases of the semiconductor industry. As the increased sensitivity of the semiconductor manufacturing process to airborne molecular contamination (AMC) produced by devices or operators, the researches on clean room contamination behavior and their impact on device performance are broadly pursued. It is known that the maintenance of a laminar flow type ventilation system around entire clean room is very expensive. In addition, it is lack of flexibility to meet different fabrication requirements when the overall manufacturing procedures are changed. The construction of mini-environment chamber and the application of AGV to transport the wafer are widely used in present.
In order to realize the phenomena within the space, the present thesis applied the CFD method to simulate an unsteady flow field producing by the motion of an automatic guided vehicle, AGV, with various speeds. The shaft airflow speed is also tested to investigate the effect of airbrush as a buffering zone. Both commercial CFD software, CFX 4.4 and FLUENT 6.1, are employed to solve the Reynolds-averaged Navier-Stokes equations. There are two main parameters: AGV moving speed and inlet airflow speed of shaft in the buffering zone. Finally, the author would apply the polluting particle concentration within the clean room to evaluate the results under above various studied parameters.
The result shows that the pollution will be diffused into two separated clean rooms when the AGV is moving across each other. The concentration of polluting particle is increasing as increase of the AGV speed. When the configuration of clean room is specified, the motion speed of AGV should be incorporated with the airflow speed of shaft to prevent the contamination diffused from one polluted zone to the other separated and clean zone.
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