Applying Taguchi''s Method to study the optimum parameter for the 50μm fine pitch on the pad in the wire bonding process of the IC Assembly
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 90 === In the semi-conductor technology industry, following progress of the technology, the trend makes varieties of electronic products falling in two different divisions : one is products demanding for light, slim, short and small, another is products with mul...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73795857214857319621 |