The study of interfacial reacitons of Sn37Pb, Sn36Pb2Ag and Sn3.5Ag ball grid array joints
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 90 === Abstract The interfacial reaction and ball shear strength of three ball grid array (BGA) solder joints - Sn37Pb, Sn36Pb2Ag and Sn3.5Ag - have been investigated for the purpose of further understanding on the lead-free joint. Ni3Sn4 layers were obse...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08222122120089418503 |