Copper Dishing Behavior During Chemical Mechanical Polishing
碩士 === 國立清華大學 === 動力機械工程學系 === 90 === The objective of this study was to establish an approach to simulate and predict the behavior of dishing. The dishing phenomenon was an key issue for the chemical mechanical planarization of wafer, especially when copper was used as the conducting ma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48951797366184605093 |