A Study of the Influence between CMP Pad Conditioning Factors
碩士 === 國立清華大學 === 動力機械工程學系 === 90 === Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. In addition, the polishing pad is one of the primary consumables in CMP. And the pad life will deeply influence the process stability and the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86967413636850074202 |