| Summary: | 碩士 === 國立清華大學 === 動力機械工程學系 === 90 === Abstract
With the development of optical fiber communication industry, the challenges for producing more cost-effective fiber-optic modules are mainly due to high Electro-optic performance, low volume production, and high reliability requirements. Fiber-in-board technology offers a full solution for those requirements. The technology is based on silicon micro-optical bench with etched V-grooves and flip-chip solder bonding. V-grooves and flip-chip solder bump designed for optical passive alignment provides a precise passive alignment packaging method. High accuracy in horizontal and vertical alignment of optical chip was attained. Silicon micro-optical bench substrates were manufactured together on silicon wafer via photolithography and thin-film processing.
Based on this concept, lots of researches investigate bumping technology and manufacturing process since 1990.This research will focus on different issue. The reliability analysis of optical passive alignment structures and the solder joint design, such as solder geometry shape control, is the main issue in this research. This research will use finite element method to analyze the mechanics behavior of testing vehicle under thermal cycling condition. In order to provide good reliable structure, this research will also use Surface Evovler to predict geometry of solder bump. The main goal of this research is using computer-aided software to design optical packaging.
Keyword : Passive Alignment, Flip Chip Solder Bump, Finite Element Method, Reliability, Optical Packaging
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