Using flip chip solder bump in optical passive alignment
碩士 === 國立清華大學 === 動力機械工程學系 === 90 === Abstract With the development of optical fiber communication industry, the challenges for producing more cost-effective fiber-optic modules are mainly due to high Electro-optic performance, low volume production, and high reliability...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78160703565345868338 |