The Study of MEMS Self-Assembly Technology

• Main Authors: Yi-Ping Ho, 何亦平
• Other Authors: Weileun Fang
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/61526163575371472609

碩士 === 國立清華大學 === 動力機械工程學系 === 90 === Surface micro-machining technology is based on the planar integrated circuit process. Due to the nature of surface micro-machining process, a fundamental problem is its inability to produce highly 3D structures. Therefore, the applications may be limited. To accomplish 3D devices after the process, residual stress of thin film, photo-resist, and ultrasound are adopted to be the self-assembly approaches. Design and fabrication of 3D optical switch is employed to demonstrate the mechanical positioning mechanisms, such as latch and hinge. Based on the MUMPs platform, this study has established an improved surface micromaching process (MUMPs-like process). Through this process, the stress-induced self-assembly 3D optical switch has been realized. According to the result of reliability test, stress relaxation is significantly reduced using the dielectric film instead of the metal film. Furthermore, this study intends to present a novel positioning mechanism for MEMS, particularly for micro-optical devices. Relied on that, more robust and reliable self-assembly mechanism is achieved.