Design and Reliability Analysis of Wafer Level Package with Bubble-Like Buffer Layer
碩士 === 國立清華大學 === 動力機械工程學系 === 90 === Recent years, semiconductor chip applied on the computer and optical communication products need to satisfy the demands of smaller, lighter, high I/O density and lower cost. The next generation packages such as CSP, flip chip and wafer level package（WLP）have enj...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98393506379282574601 |