Solder Joint Reliability Factor Study of TF-BGA by FEM
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 90 === This study aims to investigate the thermal fatigue life of the solder ball.Generally, the fatigue of the solder ball results from thermal cyclic loading in different thermal expansion coefficiency of the material in the IC package. To analyze...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93716142734716499095 |