Synthesizing Various Types Nanosize Zirconia Formulated Slurry and Study of Their Effects on Cu- and STI- Chemical Mechanical Polishings

碩士 === 國立交通大學 === 材料科學與工程系 === 90 === Various types zirconia formulated slurries were investigated for copper chemical mechanical polishing (Cu-CMP) and shallow trench isolation chemical mechanical polishing (STI-CMP) processes. Cu-CMP was investigated with slurries containing YxZr1-xO2-x...

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Bibliographic Details
Main Authors: Wang-Shen Su, 蘇旺申
Other Authors: George C. Tu
Format: Others
Language:en_US
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/70877016741296118827