Growth and Characterization of TiNiCu Alloy Thin Films

• Main Authors: Po-Yen Hsu, 許柏彥
• Other Authors: Jyh-Ming Ting
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/4a4nst

碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 90 === Deposition of TiNiCu-based thin films was performed using a dc sputter deposition technique. The target composition was varied such that a series of TiNiCu thin films with various compositions was obtained. The relationship among film composition, deposition rate and working pressure were investigated. The activation energy for crystallization was determined. The activation energy ranges form 340.4 kJ/mol to 702.3 kJ/mol, depending on the film composition. It increases and then decreases with Cu concentration and the peak value occurs at a composition of Ti45.7Ni41.1Cu13.2. Surface chemistry of TiNiCu-base thin films was analyzed to examine effects of the film composition and the exposure time to the ambient condition. The result indicates a preferential formation of TiO2, which suppresses the surface concentrations of both Ni and Cu. The TiNiCu thin films were characterized using X-ray diffraction and transmission electron microscope (TEM) for the microstructure before and after annealing.