Investigation on the Properties of Tin-Zinc Alloy by Electroplating
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 90 === The goal of this research is to produce uniform Sn-Zn eutectic deposit by electroplating. The deposit is intended to apply for Pb-free solder bump. The best electroplating condition was established by manipulating the concentration and current density...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/v5f4x7 |