A Numerical Investigation of Scale Effects for 3D CSP
碩士 === 國立成功大學 === 工程科學系碩博士班 === 90 === A numerical investigation of the scale effects for 3D CSP, including single CSP, stacked CSP and triple-chip stacked CSP, subjected to thermal cyclic loading is presented. The emphasis is on the effects of die attach thickness, substrate thickness, substrate ma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rrkke9 |