The Variation of Bulk Microdefect for Heavy Boron Doped Czochralski Silicon Crystal after Simulated Process Thermal Cycles

碩士 === 國立中興大學 === 精密工程研究所 === 90 === The P- epitaxy on heavy boron doped wafer has been well employed in power MOS device for reducing vertical on-resistance and also provide effective latch-up hardening for advanced CMOS technology. However, the micro-defect generated from the substrate...

Full description

Bibliographic Details
Main Authors: Kang Meng Yi, 康孟意
Other Authors: C.Y.Kung
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/84814589894490447802