Finite Element Analysis for Thermal Stress of MCM Package on HDIIVH Substrate
碩士 === 義守大學 === 電子工程學系 === 90 === With the trends of today electronic manufactures, the technique of electronic packet innovates constantly, and people also take account of the package of MCM gradually. Multi-layer substrate is a high circuit density substrate buried inner via holes of each layer in...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/63790526276105874397 |