Fatigue Test and Analysis for Eutectic Solder in Electronic Packaging

• Main Authors: Shieh, Wenyih, 謝文逸
• Other Authors: De-Shin Liu
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/93189166326235606633

碩士 === 國立中正大學 === 機械系 === 90 === Low cycle isothermal mechanical fatigue of a eutectic solder material is studied under total strain-controlled tests. The specimen for the test is designed as micro dog bone shaped with uniform cross section. Based on the failure criterion, 50% load drop respected to the max stress amplitude of the full cycles is used to estimate the fatigue life (cycles to failure). The Coffin-Manson model and damage-coupled model are used to describe the fatigue behavior. Furthermore, the material plastic behavior of the eutectic solder material is described as the nonlinear kinematic hardening and gives a model to fit the plastic characteristic. The finite element simulation with given nonlinear kinematic hardening model compared with experiment results shows a good agreement.