Fatigue Test and Analysis for Eutectic Solder in Electronic Packaging
碩士 === 國立中正大學 === 機械系 === 90 === Low cycle isothermal mechanical fatigue of a eutectic solder material is studied under total strain-controlled tests. The specimen for the test is designed as micro dog bone shaped with uniform cross section. Based on the failure criterion, 50% load drop respected to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93189166326235606633 |