The Study of Wire Bonding in Infrared Emitting diodes
碩士 === 國立臺灣科技大學 === 機械工程系 === 89 === There are three subjects in this study: 1. Analyzing the bonding pad of IrED chips in AES, and then judging the effect of reliability with different cleaning processes and packaging types. 2. Comparing the affects of different capillary design factors...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42640053542046076274 |