Research on Packages and PCB Codesign
碩士 === 國立臺灣大學 === 電機工程學研究所 === 89 === ABSTRACT As the number of pins in Ball Grid Array (BGA) and Pin Grid Array (PGA) packages increase, the routing of a Printed-Circuit-Board (PCB) becomes more and more difficult. CAD Tools at present time do not offer a proper integrated developing en...
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| Format: | Others |
| Language: | en_US |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47889658226379448098 |