The Processing of Sintered Heat Pipes
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 89 === Abstract Recent development in the electronic devices has forced components and sub-assemblies to become more compact. This caused thermal management to be one of the bottlenecks in further product development. Therefore, heat pipes are used to sol...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66021673944046496152 |