Analysis and Validation of Multilayered Structure for Electronic Packaging and MEMS Applications
碩士 === 國立清華大學 === 動力機械工程學系 === 89 === Calculating interfacial stresses by multilayer theory to predict the reliability of electronic package and MEMS structures are widely used for years. Nowadays, electronic package and MEMS structures are much smaller and thinner, so the mesh density of finite ele...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55824930834350207200 |