Fatigue Life Analysis for Solder Joints of Flip Chip Package
碩士 === 國立交通大學 === 機械工程系 === 89 === Flip chip package has become a very attractive solution with increasing demand on low cost, miniaturization, and weight reduction of electronic products. The major reliability issue of flip chip package is solder joint crack due to thermal expansion mis...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99203075074050538842 |